Molex Impress Co-Packaged Copper Connectors Support 224 Gbps PAM-4 Links
Molex has introduced Impress Co-Packaged Copper Solutions using a compression-based substrate connector and mating cable assembly to support data rates up to 224 Gbps PAM-4 .
Design Innovation:
The two-piece connector mounts directly to the ASIC package substrate to shorten signal paths, reduce PCB trace length, and improve signal integrity for AI and hyperscale data center systems .
While primarily targeted at data centers, this technology demonstrates the broader trend toward higher-speed, higher-density interconnect solutions that may eventually influence industrial bus cable standards.