Weima Electronics Patents High-Temperature Anti-Vibration Composite Wiring Harness Connection Structure
Source:Industrial Automation /
Time:2026-08-06
Weima Electronics has been granted a utility model patent for a high-temperature anti-vibration composite wiring harness connection structure .
Technical Innovation:
The insulation layer is made of polyimide film, forming a rigid barrier against mechanical impact and friction
The buffer layer uses silicone rubber damping strips to absorb vibration energy
The polyimide film insulation maintains stable insulating performance in high-temperature environments
Design Features:
The structure includes a protective cover, a fixed block, and a specially designed positioning structure that ensures reliable connections even under vibration and thermal stress, addressing both high-temperature and vibration challenges in industrial applications
