Molex Extends Board-to-Board Portfolio with NeoScale and SpeedMezz Families
Molex continues to expand its comprehensive board-to-board connector portfolio with the NeoScale and SpeedMezz families, offering solutions across a range of data rates and stack height requirements .
NeoScale Connectors:
Data Rate: Up to 56Gbps
Density: 82 differential pairs per square inch
Stack Heights: 12.00mm to 40.00mm
Current: Up to 8.0A per triad
Design: Mirror-image triad wafer for optimized SI
SpeedMezz Family (SpeedStack and SpeedEdge):
Data Rate: Up to 56Gbps
Pitch: 0.80mm
Stack Heights: 4.00mm to 10.00mm+
Circuits: 22, 60, 82
Common footprint enables simple changeouts
HD Mezz Connectors:
Data Rate: Up to 12.5Gbps
Stack Heights: 16.00mm to 38.00mm
Circuits: 81 to 351
Dual-contact mating interface for durability
These connector families address the diverse needs of networking, telecom, and high-performance computing applications, with design features including BGA termination, hermaphroditic interfaces, and robust construction for reliability in demanding environments .
