Rockwell Automation Introduces Compact 5000 High-Density I/O Modules
Source:Industrial Automation /
Time:2026-08-11
On May 4, 2026, Rockwell Automation introduced the Compact 5000® High-Density Modules (5069-IB32 and 5069-OB32), delivering high-performance digital I/O solutions designed for easy scaling .
Key Specifications:
32 channels of I/O per module
Nearly 40% smaller footprint compared to previous modules
Tactile press switch function allows users to select control group A or B status indicators
Designed to provide distributed I/O to CompactLogix® 5380 and GuardLogix® 5580 controllers
Supports customer migration from the 1769 architecture
The compact design increases space efficiency and expands the performance capabilities of the Logix platform without complexity. The modules are designed to simplify installation processes and maximize space savings .
