Smiths Interconnect Launches DaVinci Gen V: 224 Gbps PAM4 High-Speed Test Socket
At DesignCon 2026 (February 24-26, Santa Clara), Smiths Interconnect unveiled its flagship DaVinci Gen V high-speed test socket, engineered for AI accelerators and 6G communications.
Key Technical Specifications:
224 Gbps PAM4 digital signaling for AI accelerators
RF bandwidth: >84 GHz at -1 dB insertion loss
Supports BGA, LGA, and other package variants
Spring probe technology using homogeneous alloy with gold plating
Short signal path: 4.90 mm test height
Impedance tuned to match system
Consistent contact resistance: 55 mΩ (average)
Tri-temp socket design: -55°C to +150°C
Same socket for manual test, bench test, and HVM production test
High-Power Burn-In Socket Also Featured:
Smiths Interconnect also showcased its high-power burn-in socket, designed to support next-generation devices with:
Up to 22,000 contacts and 150 mm × 150 mm
Power management up to 2,000 W with integrated liquid cooling
500 lb applied load with 15 lb maximum closing force
Flexible thermal options including passive heatsinks and heat pipes
These solutions address the extreme demands of high-performance computing, AI data centers, and advanced automotive electronics testing .
