Smiths Interconnect High-Power Burn-In Socket Enables 2,000 W Testing
Smiths Interconnect's high-power burn-in socket (featured at DesignCon 2026) represents a significant advancement in thermal management for semiconductor testing.
Key Specifications:
Parameter | Specification |
|---|---|
Contact Count | Up to 22,000 contacts |
Device Size | Up to 150 mm × 150 mm |
Power Handling | Up to 2,000 W (with integrated liquid cooling) |
Applied Load | 500 lb (max closing force: 15 lb) |
Platform Compatibility | Universally compatible with all advanced burn-in chamber platforms |
Thermal Options | Passive heatsinks, heat pipes, liquid cooling |
Primary Function:
A specialized electromechanical interface designed to temporarily connect a semiconductor device (CPU, GPU, AI accelerator, or high-power discrete component) to a test board during burn-in and stress testing.
Durability Focus:
Built for extreme durability and thermal/electrical stability under extreme stress conditions, ensuring zero-defect policies for applications in AI data centers and automotive electronics
