TE Connectivity 28-Way DIP Surface Test Socket
TE Connectivity offers a 28-way DIP surface-mount test IC socket as part of its comprehensive IC socket portfolio, providing reliable PCB connectivity for signal applications.
Key Specifications:
Parameter | Rating |
|---|---|
Package Type | DIP |
Number of Contacts | 28 |
Number of Rows | 2 |
Pitch | 2.54 mm |
Current Rating | 3 A |
Contact Material | Beryllium Copper Alloy |
Contact Plating | Gold |
Operating Temperature | -55°C to +105°C |
Termination Type | Solder |
Housing Material | Thermoplastic (UL 94 V-0) |
Application Context:
TE Connectivity's DIP sockets are designed for high durability and reliability in electronic applications, utilizing robust through-hole solder termination for secure PCB mounting. The copper sleeve construction ensures superior electrical performance, with gold plating enhancing conductivity and longevity. These sockets are suitable for a wide operating temperature range, ensuring functionality in various conditions .
