Molex Mirror Mezz Family Supports 224Gbps with Hermaphroditic Design
Molex expanded its board-to-board connector portfolio with the Mirror Mezz family, a stackable, hermaphroditic mezzanine connector solution delivering data speeds up to 224Gbps for telecommunications, networking, and Open Compute Project (OCP)-compliant systems .
The Mirror Mezz, Mirror Mezz Pro, and Mirror Mezz Enhanced connectors share a common footprint, enabling design flexibility and streamlined upgrades. The hermaphroditic construction reduces procurement, inventory, and tooling costs while simplifying assembly operations .
Key Specifications:
Data Rate: Up to 224Gbps
Pitch: 4.00mm × 1.50mm differential pair pitch
Stack Heights: 5.00mm, 8.00mm, 11.00mm
Pin Count: Up to 270 differential pairs
Density: 107-115 DPs per square inch
Termination: Low-profile stitched BGA
The "stubless" contact interface features two points of contact on each beam for greater reliability and a low-profile minimum stack height of 5.00mm. The opposing beam support structure prevents terminal lift, ensuring consistent electrical contact even in harsh environments. The Mirror Mezz Enhanced version specifically addresses AI-driven demands with data rates up to 224Gbps PAM-4 for next-generation applications .
Recommended by OCP for board-to-board mezzanine interconnect applications, this family supports standardization for enhanced interoperability and design flexibility .
