Hirose Launches IT18 Series COM-HPC Compatible BGA Mezzanine Connector
Hirose Electric introduced the IT18 Series, a 400-position BGA mezzanine connector aligned with the COM-HPC standard, supporting PCIe Gen5 (32GT/s), PCIe Gen6 (64GT/s PAM4), and 100Gb Ethernet (4×25Gb) transmission .
The 0.635mm pitch connector targets industrial and embedded system designers who need reliable, low-profile interconnects capable of handling high-speed data in compact form factors. Available in 5mm and 10mm stacking heights, the IT18 Series is built to support advanced connectivity requirements for AI and edge computing applications .
Key Features:
400 positions at 0.635mm pitch
Supports PCIe Gen5 (32GT/s), PCIe Gen6 (64GT/s PAM4)
100Gb Ethernet via four 25Gb lanes
Stacking heights: 5mm and 10mm
Open pin-field grid array for flexible routing
Far-end crosstalk (FEXT) cancellation technology
Design Innovations:
Metal cap to reduce warpage and protect contacts during reflow
Retention tabs to reduce solder ball cracking risk
Pin-in-ball soldering structure for reliable mounting
Large alignment guide for accurate mating
Pete Lais, Assistant Vice President of Product Management at Hirose Electric Americas, stated: "The IT18 Series is designed to match the COM-HPC® recommended footprint. The mezzanine connector utilizes a narrow pitch, small-diameter BGA design to increase signal density and provide reliable high-speed performance" .
