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Source:Industrial Automation / Time:2026-08-07
EV Charging Cable Market to Reach $5.63 Billion by 2033 at 15.8% CAGR
The EV charging cable market is projected to grow from USD 2.01 billion in 2026 to USD 5.63 billion by 2033, at a CAGR of 15.8%, according to MarketsandMarkets.
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Source:Industrial Automation / Time:2026-08-07
EV Connector Market to Reach $8.84 Billion by 2033 at 13.4% CAGR
According to a MarketsandMarkets report, the EV connector market is projected to grow from USD 3.67 billion in 2026 to USD 8.84 billion by 2033, at a compound annual growth rate (CAGR) of 13.4%.
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Source:Industrial Automation / Time:2026-08-07
Molex HFM System Now Available at Heilind: Up to 28 Gbps in 80% Smaller Footprint
Heilind Electronics announced the availability of the Molex High-Speed FAKRA-Mini (HFM) Interconnect System, offering high-speed transmission up to 28 Gbps and frequencies up to 20 GHz in a compact form factor ideal for space-constrained automotive architectures.
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Source:Industrial Automation / Time:2026-08-07
Amphenol RF Adds Mini-FAKRA Connectors to Portfolio
Amphenol RF has introduced USCAR-compliant Mini-FAKRA connectors into its RF interconnect portfolio, expanding options for automotive designs requiring high data transmission rates.
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Source:Industrial Automation / Time:2026-08-07
Molex Debuts MX-DaSH Modular Wire-to-Wire Connectors for Zonal Architectures
Molex has introduced the MX-DaSH Modular Wire-to-Wire Connectors, a cartridge-based connectivity platform that combines power, signal, and high-speed data terminals into a single housing system. This modular design is purpose-built for zonal electrical architectures and enables automotive manufacturers to reconfigure wire harnesses for different vehicle models and applications.
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Source:Industrial Automation / Time:2026-08-07
Molex Introduces 25 Gbps HSAutoLink G Ethernet Connector System
Molex has expanded its HSAutoLink Interconnect portfolio with the launch of the HSAutoLink G Connector System, an automotive Ethernet connector supporting multi-gigabit data transmission of up to 25 Gbps. The system targets bandwidth-intensive applications including ADAS, LiDAR, zonal architectures, immersive displays, and central compute modules.
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Source:Industrial Automation / Time:2026-08-07
Adam Technologies Low-Profile 40-Pin DIP Socket
Adam Technologies Inc. offers a 40-pin DIP IC socket featuring a low-profile design with bellowed-type contacts and UL 94V-0 thermoplastic housing.
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Source:Industrial Automation / Time:2026-08-07
Samtec 8-Pin DIP Sockets with Tiger Eye Contacts
Samtec Inc. offers high-reliability DIP sockets featuring Tiger Eye™ contact technology and beryllium copper construction, designed for demanding applications.
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Source:Industrial Automation / Time:2026-08-07
TE Connectivity 28-Way DIP Surface Test Socket
TE Connectivity offers a 28-way DIP surface-mount test IC socket as part of its comprehensive IC socket portfolio, providing reliable PCB connectivity for signal applications.
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Source:Industrial Automation / Time:2026-08-07
Smiths Interconnect High-Power Burn-In Socket Enables 2,000 W Testing
Smiths Interconnect's high-power burn-in socket (featured at DesignCon 2026) represents a significant advancement in thermal management for semiconductor testing.
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Industrial Automation
