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Source:News / Time:2026-08-08
HARTING Introduces Surface-Mount D-Sub Connector Range for Modern Assembly Processes
In July 2026, HARTING introduced a family of surface-mount D-Sub connectors whose design has been optimised to provide compatibility with modern assembly processes as well as long-term reliability
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Source:News / Time:2026-08-08
Molex and Hirose Lead Next-Generation Mezzanine Innovation
The board-to-board connector market is experiencing rapid innovation driven by AI, 5G, and automotive electrification. Molex continues to lead with its Gemini Mezz (224Gbps+) and Mirror Mezz (224Gbps) families featuring hermaphroditic designs and fully shielded contacts for superior signal integrity . The Gemini Mezz connector uses fully shielded differential pair terminations to minimize crosstalk and EMI at 224Gbps+ .
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Source:News / Time:2026-08-08
Würth Elektronik Board-to-Board Solutions Featured in Signal Integrity Analysis
Würth Elektronik's WR-BTB board-to-board connector series was highlighted in a detailed signal integrity analysis from DigiKey, emphasizing the importance of controlled impedance and low insertion loss for high-speed applications .
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Source:News / Time:2026-08-08
Nicomatic Addresses High-Density Mezzanine Challenges with Matr'YX Connector
Nicomatic introduced its Matr'YX connector as a solution for high-density board-to-board stacking in harsh environments, featuring a 4-point contact architecture that eliminates the risk of signal interruption
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Source:News / Time:2026-08-08
Amphenol Showcases cLGA Mezzanine Contact Technology at DesignCon 2026
Amphenol Showcases cLGA Mezzanine Contact Technology at DesignCon 2026 Amphenol demonstrated its next-generation cLGA (compression Land Grid Array) contact technology at DesignCon 2026, featuring a mezzanine connector supporting 224G speeds . The technology was showcased in partnership with Rohde & Schwarz, with live signal integrity measurements including insertion loss and eye diagrams at 224Gbps data rates. The cLGA contact design is engineered to meet the extreme performance requirements of next-generation system architectures . This demonstration highlights the industry's continued push toward higher-speed board-to-board interconnects as AI, data center, and high-performance computing applications demand ever-increasing bandwidth density .
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Source:News / Time:2026-08-08
Molex Extends Board-to-Board Portfolio with NeoScale and SpeedMezz Families
Molex continues to expand its comprehensive board-to-board connector portfolio with the NeoScale and SpeedMezz families, offering solutions across a range of data rates and stack height requirements
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Source:News / Time:2026-08-08
I-PEX Launches NOVASTACK 35-HDP 12 with 1.2mm Mating Height
I-PEX announced the NOVASTACK® 35-HDP 12, a new addition to its board-to-board connector series featuring a mating height of 1.2mm and four power contacts supporting 4.5A per pin
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Source:News / Time:2026-08-08
Hirose Introduces FX36 Series Floating Board-to-Board Connector for EV Powertrains
Hirose Electric released the FX36 Series, a 0.5mm pitch floating board-to-board connector designed for harsh automotive powertrain environments in BEV/HEV inverters, converters, and onboard chargers .
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Source:News / Time:2026-08-08
Hirose Launches IT18 Series COM-HPC Compatible BGA Mezzanine Connector
Hirose Electric introduced the IT18 Series, a 400-position BGA mezzanine connector aligned with the COM-HPC standard, supporting PCIe Gen5 (32GT/s), PCIe Gen6 (64GT/s PAM4), and 100Gb Ethernet (4×25Gb) transmission
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Source:News / Time:2026-08-08
Molex Mirror Mezz Family Supports 224Gbps with Hermaphroditic Design
Molex expanded its board-to-board connector portfolio with the Mirror Mezz family, a stackable, hermaphroditic mezzanine connector solution delivering data speeds up to 224Gbps for telecommunications, networking, and Open Compute Project (OCP)-compliant systems .
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