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Source:News / Time:2026-08-07
Molex Introduces 25 Gbps HSAutoLink G Ethernet Connector System
Molex has expanded its HSAutoLink Interconnect portfolio with the launch of the HSAutoLink G Connector System, an automotive Ethernet connector supporting multi-gigabit data transmission of up to 25 Gbps. The system targets bandwidth-intensive applications including ADAS, LiDAR, zonal architectures, immersive displays, and central compute modules.
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Source:News / Time:2026-08-07
Adam Technologies Low-Profile 40-Pin DIP Socket
Adam Technologies Inc. offers a 40-pin DIP IC socket featuring a low-profile design with bellowed-type contacts and UL 94V-0 thermoplastic housing.
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Source:News / Time:2026-08-07
Samtec 8-Pin DIP Sockets with Tiger Eye Contacts
Samtec Inc. offers high-reliability DIP sockets featuring Tiger Eye™ contact technology and beryllium copper construction, designed for demanding applications.
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Source:News / Time:2026-08-07
TE Connectivity 28-Way DIP Surface Test Socket
TE Connectivity offers a 28-way DIP surface-mount test IC socket as part of its comprehensive IC socket portfolio, providing reliable PCB connectivity for signal applications.
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Source:News / Time:2026-08-07
Smiths Interconnect High-Power Burn-In Socket Enables 2,000 W Testing
Smiths Interconnect's high-power burn-in socket (featured at DesignCon 2026) represents a significant advancement in thermal management for semiconductor testing.
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Source:News / Time:2026-08-07
Semiconductor Test Socket Market Report 2026: Burn-In and Test Sockets Differentiated
Bosson Research’s 2026 report provides comprehensive analysis of the global semiconductor test socket market, highlighting the crucial distinction between test sockets and burn-in sockets.
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Source:News / Time:2026-08-07
Semiconductor Test Socket Market Strategy 2026-2031: AI and Advanced Packaging Drive Structural Expansion
A strategic market analysis by Prof Research reveals the semiconductor test socket market is undergoing a structural expansion, exiting its historical position as a commoditized backend consumable.
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Source:News / Time:2026-08-07
Smiths Interconnect Launches DaVinci Gen V: 224 Gbps PAM4 High-Speed Test Socket
At DesignCon 2026 (February 24-26, Santa Clara), Smiths Interconnect unveiled its flagship DaVinci Gen V high-speed test socket, engineered for AI accelerators and 6G communications
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Source:News / Time:2026-08-07
Orum Material Develops Ultrafine Test Socket to Boost HBM Yields
Orum Material announced on March 19, 2026, that it has developed an ultrafine test socket capable of probing micro-bumps on HBM DRAM dies—the first in the industry. The technology was presented at TestConX 2026 in Mesa, Arizona.
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Source:News / Time:2026-08-07
Modus Test and yieldWerx Partner to Close Socket-to-Silicon Correlation Gap
Modus Test, a leader in advanced test socket testing solutions, and yieldWerx, a semiconductor data and yield analytics platform, announced a strategic partnership to close the gap between test hardware and yield intelligence.
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